Amkor Technology Announces Availability of First Ever QFN Package Design Kit for Agilent Technologies’ Advanced Design System So

CHANDLER, Ariz. -- Amkor Technology, Inc. (Nasdaq:AMKR) today announced the availability of its Quad Flat No-Lead (QFN) package design kit for Agilent Technologies’ Advanced Design System (ADS) electronic design automation software. This innovative package design kit is the first ever available for ADS.

Based on Amkor’s popular

title="Microleadframe QFN MLF">MicroLeadFrame

® (MLF®) packages, the package design kit enables mutual Amkor and Agilent customers to significantly improve their RFIC / MMIC design quality and time-to-market. It allows designers to quickly explore various design specifications with accurate package information and implement optimized RFIC/MMIC designs, providing a greater range of choices and more flexibility when designing QFN packages.

“Our customers demand ever-increasing design effectiveness and efficiency to achieve their business objectives with today’s sophisticated QFN packages,” said ChoonHeung Lee, Amkor Technology Korea’s corporate vice president and chief technology officer. “As Agilent is the RF and microwave CAD leader and many of our customers already use ADS for circuit design and characterization, we are excited to offer this first ever package design kit to our mutual customers.”

“Our customers are looking for easy ways to accurately characterize vendor-supplied packages, both alone and with ICs and laminates mounted,” said Todd Cutler, planning and marketing senior manager with Agilent’s EEsof EDA organization. “Amkor is one of the world’s leading outsourced assembly and test services providers, and we are extremely pleased with this package design kit. This collaboration between Amkor and Agilent delivers significant benefits for our mutual customers, and illustrates our aligned focus on meeting customer needs.”

The Amkor package design kit contains models for 3x3, 4x4, 5x5, and 6x6 MLF® QFNs. All die are scalable, and their material properties can easily be modified. The Amkor package design kit also includes scalable models for bond pad arrays and board via arrays. The Amkor package design kit was developed for use with ADS 2009 Update 1 and ADS 2011.01.

Availability

Customers can request the QFN Package Design Kit from the Amkor website at

title="QFN Package Design Kit for Agilent Technologies’ Advanced Design System Software">www.amkor.com/go/ads

About Amkor

Amkor is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company's SEC filings and on Amkor's website: www.amkor.com

Contact:

Amkor Technology, Inc., Chandler
Greg Johnson
Sr. Director, Corporate Communications
480-786-7594
greg.johnson@amkor.com

or

Agilent Technologies
Janet Smith
970-679-5397
janet_smith@agilent.com