Avago and Amphenol Jointly Developed New Micro LGA Integrated Socket Solution for 40G/100G Ethernet/OTN Applications

New Snap-and-Go Micro LGA Integrated Socket Simplifies Board Design and Assembly

SAN JOSE, Calif., and SINGAPORE,&nbsp March 14, 2013

Avago Technologies (Nasdaq: AVGO) and Amphenol Corporation (NYSE: APH) today announced a new micro cLGA® integrated socket solution for use with Avago’s high bandwidth MicroPODTM optical modules for 40G/100G Ethernet and Optical Transport Network (OTN) applications.

The new snap-and-go micro cLGA® integrated socket is specifically designed to interface with the Avago MicroPOD embedded parallel optics transceiver products. The socket integrates a thermal heat sink with the PCB connector retention mechanism needed with the Avago MicroPOD electrical interface. More importantly, this new integrated socket significantly simplifies the board design and assembly while preserving the industry’s smallest socket footprint.

Avago will be showcasing a joint demonstration of its new embedded parallel optics transceivers using the new snap-and-go micro cLGA integrated sockets from Amphenol. The demonstration will be in the Avago Booth #1043 at the OFC/NFOEC 2013 exhibition in Anaheim, California, USA from March 19th to 21st.

“Avago Technologies is excited to have partnered with Amphenol InterCon Systems to provide this value-added integrated socket solution for use with the Avago MicroPOD optical modules,” said Philip Gadd, vice president and general manager of the Fiber Optics Product Division at Avago. “We believe this simple integrated socket solution will enable system companies to easily design in MicroPOD embedded optics solutions, thereby enabling greater system bandwidth, higher port density, better system performance and lower total system costs.”

“This collaboration with Avago has been a natural extension of our cLGA technology: a high density, low profile design that covers every aspect of the required mechanical specification,” said Daniel Barrett, General Manager, Amphenol InterCon Systems & Mezzanine Products (www.interconsystems.com). “The snap on heat sink and compression spring is an innovation that really makes this easy to use.  We are excited to be a participant and an enabler for Avago’s technology.”

About Avago Technologies
Avago Technologies is a leading designer, developer and global supplier of a broad range of analog, mixed signal and optoelectronics components and subsystems with a focus in III-V compound semiconductor design and processing. Backed by an extensive portfolio of intellectual property including approximately 4,200 patents and pending applications, Avago products serve three primary target markets: wireless communications, wired infrastructure, and industrial and other. Avago has a global employee presence and heritage of technical innovation dating back 50 years to its Hewlett-Packard roots. For more information, visit Avago’s website: www.avagotech.com.

About Amphenol Corporation
Amphenol Corporation is one of the world’s leading producers of electronic and fiber optic connectors, cable and interconnect systems. Amphenol products are engineered and manufactured in the Americas, Europe, Asia and Africa and sold by a worldwide sales and marketing organization. Amphenol has a diversified presence as a leader in high growth areas of the interconnect market including: military, commercial aerospace, automotive, broadband communication, industrial, information technology and data communications equipment, mobile devices and wireless infrastructure. For more information, visit http://www.amphenol.com

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