DENSO and Japan Gore-Tex Develop a CCL resin for "PALAP" Board, High-Performance Multi-layered PCB

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DENSO Corporation and Japan Gore-Tex Inc. announced today that they have jointly developed a copper clad laminate (CCL) resin called PAL-CLAD for use in "PALAP -(Patterned Prepreg Layup Process)" board, the next-generation, high-performance multi-layered print circuit board (PCB).

Date: 05/29/2002

TOKYO - DENSO Corporation and Japan Gore-Tex Inc. announced today that they have jointly developed a copper clad laminate (CCL) resin called PAL-CLAD for use in "PALAP -(Patterned PrepregLayupProcess)" board, the next-generation, high-performance multi-layered print circuit board (PCB).

PALAP board was developed by DENSO to meet the rapidly increasing demand in recent years for miniaturization, higher performance, and higher quality of electronic products. It is a multi-layered PCB produced by unconventional but very simple process involving only one pressing operation.

PAL-CLAD is characterized by the electrical properties and heat resistance of BIAC, a recyclable thermoplastic resin film produced by Japan Gore-Tex Inc. It is also characterized by the excellent processing property for forming vias, which are holes for electrically interconnecting layers of a multi-layered PCB, and the ease of layering by one pressing operation. Those properties are important factors in producing PALAP boards.

DENSO has started using PAL-CLAD for the prototypes of PALAP boards. Japan Gore-Tex aims to produce more than half a million square meters of the material in 2004, when PALAP boards is expected to be in mass production.

Compared to the conventional PCB processing, where lamination, curing, and wiring patterning are repeated layer after layer, PALAP boards can be multi-layered by pressing together all thermoplastic resin layers each having wiring patterns. This enables significantly improved quality, lower costs and shorter delivery times. As added benefits, PALAP boards realize high interconnecting reliability by adopting metallic past for filling vias, and have excellent high-frequency properties due to a low dielectric constant.

PALAP boards also give due consideration to the environment, one of the major issues requiring action in the area of electronics products, including those used in information technology and automobiles. Because PALAP boards use thermoplastic resin for its base material, it enables material recycling in which only the resin is separated and reused.

DENSO Corporation, headquartered in Kariya, Aichi prefecture, Japan, is a leading global supplier of advanced technology, systems and components. Worldwide, the company employs 87,000 people in 30 countries and regions, including Japan. DENSO common stock is traded on the Tokyo, Osaka and Nagoya stock exchanges in Japan.

Contact:

Sadayoshi Yokoyama
+81 566-25-5594

sadayoshi_yokoyama@denso.co.jp

Goro Kanemasu
+81 566-25-5594

goro_kanemasu@denso.co.jp

News Source : DENSO and Japan Gore-Tex Develop a CCL resin for "PALAP" Board, High-Performance Multi-layered PCB