Ensure Your Packaging Lines Are Equipped to Meet Market Demand

Emerson Network Power Embedded Computing's picture
Printer-friendly versionPrinter-friendly version

Packaging lines that attempt to accommodate increasing package complexity with existing equipment and operations are likely to experience higher operating costs, decreased production, and increased risk to operators. Emerson’s technologies leverage powerful, cost-effective automation capabilities to improve productivity through more efficient machines and changeovers; reduce material waste; and enable safer interactions between operators and machines. Visit us at PACK EXPO to learn more:

Date: September 25-27, 2017

Location: Las Vegas, Nevada

Booth Number: ​​​​​​​C-5222

Find the Emerson exhibit at Pack Expo Las Vegas

Download Map

In the Emerson Booth (C-5222)

The Emerson exhibit will feature demonstrations of technologies that can help packaging lines increase flexibility, integrate connectivity, enhance safety, and reduce contamination and waste. Feature demonstrations include:

  • Real-time leak detection
  • Ultrasonic welding and food cutting
  • Zoned safety for pneumatic energy isolation
  • High-speed precision filling
  • Power quality solutions
  • Hygienic instrumentation

Speak with our packaging industry experts to learn how to ensure your packaging operations remain safe, competitive and profitable.

Featured Presentations

Featured Speaker: Mike Mediana

Packaging Market Segment Manager,

Emerson Automation Solutions

​​​​​​​Migrating from Traditional Package Sealing Technologies to Ultrasonics in Flexible Packaging Applications

Driven by consumer preference, the demand for flexible packaging in the medical, consumer product, and food and beverage industries is increasing. Learn how ultrasonic sealing is helping machine builders and end users transition from rigid to flexible packaging so that they can effectively respond to market demands.

Time: 10:00-10:30 AM

Location: Innovation Stage, C-1041

Amazing Packaging Race

Sept,. 27, 9:00 a.m. - Emerson will return this year as the headline sponsor of the Amazing Packaging Race at PACK EXPO. On the final day of the conference, university engineering students from around the United States will compete to complete a series of tasks assigned by exhibitors. The race will conclude with the announcement of the winning team at the Emerson booth (C-5222).

Emerson's Packaging Expertise

Deliver more precisely, operate more efficiently, and consume less energy while safely moving your packaging from the design table to consumers.

Copy this html code to your website/blog to embed this press release.


Post new comment

8 + 11 =

To prevent automated spam submissions leave this field empty.