Agreement Continues Momentum for Intrinsyc’s System on Module Line
VANCOUVER, BRITISH COLUMBIA – January 29, 2014 – Intrinsyc Software International, Inc. (“Intrinsyc”) (TSX: ICS), a leading provider of solutions for the development of embedded and wireless devices, today announced the signing of a design and development agreement with an Original Equipment Manufacturer (“OEM”) for a wearable display device based on Intrinsyc’s Open-Q 8074 System on Module (“SOM”). This is the fifth announced design win for Intrinsyc’s Open-Q SOMs in recent months, and the third announcement this month.
Intrinsyc’s Open-Q 8074 is a compact, production-ready, SOM delivering industry leading CPU, GPU and DSP performance, energy efficiency, and rich multimedia capabilities for embedded computing applications. The SOM’s small form factor, advanced technology, and extensive range of supported peripherals provides the ideal platform for creating high performance embedded devices.
The Open-Q 8074 SOM offers industry leading features and capabilities:
Quad core high performance CPUs, up to 2.15 Ghz
Memory: 2GB of LPDDR3 RAM, 16GB of eMMC
GPU for advanced graphics
DSP up to 600 Mhz for ultra low power applications
Video encode/decode up to Ultra HD
2 x MIPI/DSI and 1 x HDMI up to 4K
2 x Camera ISP engines and up to 30MP camera support
Wi-Fi 802.11n, Bluetooth 4.0
“Intrinsyc’s Open-Q 8074 SOM is an ideal fit for wearable displays due to its industry leading multimedia performance, as well as energy and thermal efficiency” commented Tracy Rees, CEO, Intrinsyc. "It’s good to see the increasing design wins and interest for Intrinsyc’s Open-Q line of system on modules, across a number of high-end embedded verticals, including wearable displays, robotics, consumer media, digital signage, medical imaging, and video conferencing.”
Agreement and product details remain confidential at the customer’s request.
About Intrinsyc Software International, Inc.
Intrinsyc Software International, Inc. (www.intrinsyc.com) is a product development company that provides hardware, software, and service solutions that enable next-generation embedded and wireless products. Solutions span the development life cycle from concept to production. These solutions help device makers and technology suppliers create compelling differentiated products with faster time-to-market. Intrinsyc is publicly traded (TSX:ICS) and is headquartered in Vancouver, BC, Canada.
Intrinsyc, Soleus, Destinator and their respective logos are trademarks, registered and otherwise, of Intrinsyc Software International, Inc. in Canada, European Union, Taiwan, United States of America and other jurisdictions. Other products and services mentioned in this document are identified by the trademarks or service marks of their respective companies or organizations.