IPDiA, leading manufacturer of passive components, has developed a range of silicon interposers which, when combined with Integrated Passives Devices (IPD) and Through Silicon Vias (TSV), offer an economic model and an evolutionary technological approach perfectly adapted to implantable medical devices and high value applications targeting an higher miniaturization.
Caen, France April 30, 2014 - (PressReleasePoint) -
These 2.5D Silicon Interposers exhibit outstanding performances that are perfectly fitted with such domains:
Optimized miniaturization and decrease of the total weight of the device thanks to a very high level of integration made possible by the compatibility with Through Silicon Via and Integrated Passive Device technologies.
High stability and high reliability due to a very small CTE mismatch between the substrate and the external ICs (silicon-silicon compatibility).
Schematic of IPDiA 2.5D interposer with IPD and external
active dies in flip-chip or hip-on-silicon technologies
The above figure shows that the silicon not only serves as a redistribution layer but also allows the integration of passive components within the substrate. The copper vias enable higher density and shorter connection lengths compared with wire bonded solutions and are fully matched to face the increasing demand for faster signals and lower power use.
About IPDiA IPDiA is a preferred supplier of high performance, high stability and high reliability silicon passive components to customers in the medical, automotive, communication, industrial, and defense/aerospace markets. The company portfolio includes standard component devices such as silicon capacitors, ESD protection devices as well as customized devices. IPDiA headquarters are located in Caen, France. The company operates design centers, sales and marketing offices and a manufacturing facility certified ISO 9001 / 14001 / 18001 / 13485 for medical devices as well as ISO TS 16949 for the Automotive market. www.ipdia.com