Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) will features its market leading Automated Optical (AOI) and Automated X-ray Inspection (AXI) systems in Booth #2025 at the upcoming IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, USA.
Nordson YESTECH’s FX SL AOI offers high speed “capture on the fly” inspection and utilizes a flexible and comprehensive set of inspection tools, including angled cameras, a 3D height sensor, advanced Fusion Lighting™, full color digital image processing technology and both image- and rule-based algorithms. Configurable for all line positions, the FX Series is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
With Nordson YESTECH's advanced color camera imaging technology, the system offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera and four side-viewing cameras, the FX SL inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.
Also at the show will be Nordson YESTECH BX AOI which offers off-line benchtop PCB inspection with exceptional defect coverage and the Nordson YESTECH BX-UV which makes inspection of conformal coatings simple and convenient by automating the inspection process for quality and consistency of coatings under UV lighting with the use of proprietary inspection algorithms.
Nordson YESTECH will also feature the X3 Automated X-Ray Inspection System. This system offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the X3's innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.