Panel will address the question: “Will FPGAs Crack Mobile?”
QuickLogic Corporation (NASDAQ: QUIK), the innovator in low-power Customer Specific Standard Products (CSSPs), today announced that QuickLogic’s CTO, Tim Saxe, will participate in a panel discussion entitled “Will FPGAs Crack Mobile?” at the upcoming FPGA 2014 conference. The 22nd ACM/SIGDA International Symposium on Field-Programmable Gate Arrays is a premier conference for presentation of advances in all areas related to FPGA technology.
Date: February 26-28
Venue: Monterey Conference Center, Monterey
Panel: Will FPGAs Crack Mobile? (Feburary 27 at 7:30 p.m. during the event banquet)
The panel will address the challenges faced by mobile OEMs, system designers and ecosystem developers that can potentially be addressed by the FPGAs. Questions to be addressed include the functionality that FPGAs need to provide as well as the power, size and cost constraints they need to meet in order to become widely adopted for mobile device applications.
QuickLogic Corporation (NASDAQ: QUIK) is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com.
QuickLogic is a registered trademark and the QuickLogic logo is a trademark of QuickLogic Corporation. All other brands or trademarks are the property of their respective holders and should be treated as such.