Rudolph Receives Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

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Large order for multiple NSX inspection tools includes Wafer Scanner system and Discover yield management software to provide a comprehensive 2D/3D solution for advanced packaging processes

Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing services in assembly and test (OSAT). The order includes: multiple NSX® systems for two-dimensional (2D) macro defect inspection, the Wafer Scanner™ Inspection Series for three-dimensional (3D) inspection and bump height metrology, and Discover® software for yield optimization. The sale demonstrates Rudolph’s continuing leadership in providing comprehensive inspection and metrology solutions for today’s most advanced wafer-level chip-scale packaging (WLCSP) and bumping processes.

“The importance of advanced packaging processes continues to grow as semiconductor manufacturers seek to pack more power and capability into smaller and smaller packages,” said Mike Goodrich, vice president and general manager of Rudolph’s Inspection Business Unit. “We provide a comprehensive solution to help our customers ensure the performance of these challenging new processes. The Wafer Scanner system provides fast 3D inspection and measurement of bumping processes and the NSX system delivers high-throughput 2D inspection of complex patterns and components such as redistribution layers (RDL) and under bump metal. The Discover software ties it all together with sophisticated yield enhancement capabilities.”

“By providing an intelligent, comprehensive solution we were able to reduce the amount of review and improve the net throughput and net utilization in the factory. Our Fleet Management capabilities include recipe management and ensure consistent performance across multiple systems,” Goodrich adds.

The NSX family is the market leader for automated macro defect inspection for advanced packaging processes. NSX systems include specific solutions for processes using through silicon vias (TSVs) to connect multiple die in a single package, as well as edge trimming, wafer alignment during bonding processes and sawn wafers on film frames. Rudolph’s Wafer Scanner System provides the inspection and metrology for 3D/2D bumps and RDL required throughout post-fab processes for both standard and flip chip wafers.

Discover Software is Rudolph’s inline defect and metrology analysis and data management system. When bundled with Fleet Management, engineers in a high volume environment are able to assess the performance of recipes across multiple tools and multiple products, typical of a high volume OSAT. In addition, expert knowledge can be programmed into the system and applied to data monitoring 24x7. This software sale builds upon the customer’s previous installation of fault detection and classification (FDC) software, implemented across the entire factory for process control and yield improvement.

For more information, please visit: http://www.rudolphtech.com

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About Rudolph Technologies

Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at http://www.rudolphtech.com

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Safe Harbor Statement

This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefits to customers of Rudolph’s products, Rudolph’s existing market position and its ability to maintain and advance such position relative to its competitors and Rudolph’s ability to meet the expectations and needs of our customers as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, the challenges presented by the new product development and marketing, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2013 and other filings with the Securities and Exchange Commission.  As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

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