Rudolph Technologies to Participate in the DA Davidson 6th Technology Forum Investor Conference

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FLANDERS, NEW JERSEY (May 27, 2014) – Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, today announced that the Company will participate in the DA Davidson 6th Technology Forum Investor Conference to be held at the Grand Hyatt Hotel in New York, NY on Wednesday, May 28, 2014.  The Conference consists of a series of one-on-one meetings arranged by DA Davidson. Steven Roth, senior vice president and chief financial officer, will provide an overview of the Company and will discuss its competitive position and future prospects.

Investors wishing to arrange for a meeting with Mr. Roth should contact their DA Davidson representative directly.

Presentation materials in conjunction with Rudolph’s presentation may be found under the “Investors” section of the company’s website www.rudolphtech.com.

About Rudolph Technologies

Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

News Source : Rudolph Technologies to Participate in the DA Davidson 6th Technology Forum Investor Conference
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