Semiconductor Press Release

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10/20/2017 - 06:34
QuickLogic to Showcase Latest eFPGA and Sensor Processing Solutions at ARM TechCon 2017
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QuickLogic
10/20/2017 - 06:06
BiTMICRO Announces NEW MAXio S-Series NVMe Low Profile 8TB Add-In Card
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BiTMICRO
10/19/2017 - 15:17
Power Integrations Enables No-Neutral Wireless Wall Switches for Smart-Home Lighting
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PowerIntegrations
10/19/2017 - 14:47
North American Semiconductor Equipment Industry Posts September 2017 Billings
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SEMI
10/19/2017 - 14:44
Senate finally poised to restore FTC to full strength
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R Street Institute
10/18/2017 - 21:11
IIJ and Hirata to Begin Business Partnership in the Smart Factory Sector
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Internet Initia...
10/18/2017 - 13:32
WARF announces annual grant figures and Innovation Award winners
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University of W...
10/18/2017 - 10:57
Synopsys and NXP Extend Multiyear Automotive Center of Excellence Collaboration for NXP S32 Automotive Processing Platform
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Synopsys
10/18/2017 - 08:45
Entegris Initiates Quarterly Cash Dividend
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Entegris
10/18/2017 - 08:38
Terahertz spectroscopy goes nano
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BrownUniversity
10/18/2017 - 07:04
Micron Announces Actions to Retire $2.25 Billion in Debt
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Micron
10/18/2017 - 03:22
Q3 Sales Strong Across the Full Product Portfolio - Very Strong Demand for DUV Systems, EUV Shipments Continue to Ramp in Support of Customer Plans
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ASML
10/17/2017 - 17:47
Power Integrations Expands Asian Presence With New Production-Support and R&D Center in Malaysia
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PowerIntegrations
10/17/2017 - 11:33
Synopsys Expands DesignWare IP Portfolio with Acquisition of Sidense Corporation
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Synopsys
10/17/2017 - 09:46
ON Semiconductor Introduces Preconfigured Development Suite Providing Easier Way to Build Hearing Aids
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ON Semiconductor
10/17/2017 - 09:41
Ixia Test Solution Helps Corsa Technology Validate Design of Network Security Enforcement Device
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Ixia
10/17/2017 - 08:53
MaxLinear Full-Spectrum Capture DOCSIS 3.1 Chipsets Power Hitrons Full Duplex Demonstration
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MaxLinear
10/17/2017 - 08:18
New SEMI Market Research Report: China IC Industry Outlook
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SEMI
10/17/2017 - 07:57
University of Illinois Turns to Tektronix to Outfit Nanofabrication Lab
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Tektronix
10/17/2017 - 06:25
New Techniques Boost Performance of Non-Volatile Memory Systems
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NCStateUniv
10/17/2017 - 05:53
Electroplating: the birth of a single nucleus caught in camera
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University of B...
10/16/2017 - 18:03
Huawei Unveils the HUAWEI Mate 10 and HUAWEI Mate 10 Pro
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Huawei
10/16/2017 - 17:39
Wafer Shipments Forecast to Increase in 2017, 2018 and 2019
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SEMI
10/16/2017 - 10:05
Littelfuse Introduces Industrys First SCR Thyristor with 150C Junction Temperature in D-PAK Packaging
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Littelfuse
10/16/2017 - 06:05
Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New Automotive MCU Solution
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Cypress
10/16/2017 - 05:15
Micron Appoints Manish Bhatia as EVP of Global Operations
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Micron
10/16/2017 - 03:51
University spin-outs announced as winners of major venture capital initiative
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University of B...
10/16/2017 - 02:09
Accellera Systems Initiative Advances the SystemC Ecosystem with a New Core Language Library
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Accellera
10/16/2017 - 01:32
Spin Transfer Technologies and Tokyo Electron Join Forces to Bring MRAM to the Next Level
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Tokyo Electron
10/15/2017 - 22:32
NXP Announces New Automotive Processing Platform that Brings Future Vehicles to Market Faster
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NXP
10/13/2017 - 10:08
Infineon partners with Smart Wires to shape up existing grids for renewables
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Infineon Techno...
10/12/2017 - 15:29
Physics postdoc and mentor awarded prestigious LOreal fellowship
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University of B...
10/12/2017 - 12:42
Purple power: Synthetic purple membranes transform sunlight to hydrogen fuel
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Argonne Nationa...
10/12/2017 - 11:12
Arrow Electronics, NXP and Synaptics Team to Accelerate the Development of Amazon Alexa-Enabled Smart Home Products
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Synaptics Incor...
10/12/2017 - 08:47
HUSCO CEOs Year in White House Ignites Passion for Policy Reform
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Association of ...
10/12/2017 - 07:13
IEEE Approves Standard Amendment Project to Meet Demand for Greater Than 1 Gb/s Automotive Ethernet
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IEEE Standards ...
10/12/2017 - 06:51
Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX Process Technology
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Cadence
10/12/2017 - 06:50
Press Release - Toradex launches Easy-to-Integrate Camera Module
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Toradex
10/12/2017 - 05:31
API Technologies Enters European Design and Manufacturing Alliance with Analog Devices
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APITech
10/12/2017 - 04:46
Media Alert: QuickLogic CTO to Present at 15th Annual International SoC Conference
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QuickLogic
10/12/2017 - 03:12
Littelfuse China Operations Receives Manufacturing Excellence Awards
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Littelfuse
10/12/2017 - 01:30
Lattice Semiconductor to Discuss Business Outlook at Todays Analyst & Investor Meeting
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Lattice Semicon...
10/12/2017 - 01:08
Gartner Says Worldwide Semiconductor Revenue to Reach $411 Billion in 2017
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Gartner
10/11/2017 - 14:05
A.G. Schneiderman Appoints New Chief Economist
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New York Attorn...
10/11/2017 - 12:00
Injecting Electrons Jolts 2-D Structure Into New Atomic Pattern
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Berkeley Lab
10/11/2017 - 10:42
Despite ongoing legal battles, Apple reinforces Qualcomms modem design leadership in new product line-up
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ABI Research
10/11/2017 - 10:34
Cadence Achieves TUV SUDs First Comprehensive Fit for Purpose - TCL1 Certification in Support of Automotive ISO 26262 Standard
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Cadence
10/11/2017 - 10:08
High Temperature Alternistor Triacs Simplify Thermal Management, Handle High Surges
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Littelfuse
10/11/2017 - 03:17
Watch the videos of the 2017 EIT Innovators Award Nominees
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EIT
10/11/2017 - 02:18
QuickLogic Partners with AcconSys to Expand eFPGA Design Activity in China
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QuickLogic
10/10/2017 - 21:50
Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform
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Cadence
10/10/2017 - 20:15
Micron Announces Pricing of $1.2 Billion Offering of Common Stock
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Micron