Tessera Licenses SHELLCASE MVP Technology to Nemotek

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SHELLCASE Technology Provides High-Yield, Highly-Reliable

Solutions for Image Sensors in Next-Generation Mobile Devices

SAN JOSE, Calif. & RABAT, Morocco--April 29, 2008 "(PressReleasePoint)"--Tessera Technologies, Inc. (Nasdaq:TSRA), a leading provider of miniaturization technologies for the electronics industry, and Nemotek S.A. today announced that Nemotek has licensed the SHELLCASE(R) MVP wafer-level chip-scale packaging (WLCSP) solution from Tessera. The SHELLCASE MVP solution, which Tessera announced on March 18, 2008, will enable Nemotek to provide original equipment manufacturers (OEMs) and camera module manufacturers with the ability to build smaller, thinner and more sophisticated consumer devices, such as camera phones, digital cameras, PDAs and laptops.

"With the licensing of Tessera's latest SHELLCASE MVP solution, Nemotek is once more showing its commitment to offering the best wafer-level packaging technology available to its customers," said Youssef Benmokhtar, director of marketing and business development, Nemotek. "We are making the transition from traditional packaging technology to the latest Through Silicon Via (TSV) wafer-level packaging technology possible by offering high-volume capabilities to image sensor makers around the world. Production ramp up of our SHELLCASE technology-based solutions will start in the first quarter of 2009."

The SHELLCASE MVP solution addresses market demand for more advanced technologies in image sensor packaging, including a thinner package, higher yield, enhanced reliability and lower cost. The new technology, which is one of the industry's first Through Silicon Via (TSV) solutions, provides manufacturers with the ability to develop thinner, more sophisticated consumer devices faster at a lower overall cost; it also complies with JEDEC Level 1 requirements, making it suitable for harsher applications such as automotive. The SHELLCASE MVP solution also enables manufacturers to utilize image sensor wafers without requiring any chip design modification, providing additional time and cost savings.

"We commend Nemotek for embracing the new Through Silicon Via technology we're offering in our SHELLCASE MVP packaging solution," said Bents Kidron, vice president of marketing, Wafer-Level Packaging, Tessera. "We believe that in licensing the SHELLCASE MVP technology, Nemotek is one step ahead of their competitors. Both Nemotek and their customers will reap the benefits of higher yield and lower production costs, which will be passed on in the form of cost savings throughout the manufacturing supply chain."

About SHELLCASE Technology

SHELLCASE wafer-level chip-scale packaging (WLCSP) technology provides high-yield, highly-reliable manufacturing solutions for image sensors used in next-generation mobile devices. The technology enables very low profile camera modules while significantly reducing assembly yield loss from contamination, providing OEMs with greater design flexibility and an innovative tool in the development of thinner mobile devices. The SHELLCASE RT solution enables one the thinnest, most cost-effective form factors for image sensor packaging with JEDEC Level 1 reliability, while the SHELLCASE CF solution provides a high-yield, low-cost alternative to traditional Chip on Board (CoB) packaging. The SHELLCASE MVP technology, one of the industry's first Through Silicon Via (TSV) solutions, supports 3D die-stacking of the image sensor with other ICs.

About Nemotek

Nemotek is the world's first licensee of both the SHELLCASE(R) and OptiML(TM) technologies from Tessera. The company provides a broad range of wafer-level packaging and consumer optics solutions, making it the best choice for wafer-level camera module manufacturing. Nemotek headquarters are located in Rabat, Morocco. For more information, please contact us at +212 3756 5044 or visit our website www.nemotek.ma.

About Tessera

Tessera Technologies, Inc. is a leading provider of miniaturization technologies for the electronics industry. The company provides a broad range of advanced packaging, interconnect, and consumer optics solutions which are widely adopted in high-growth markets including consumer, computing, communications, medical and defense electronics. Tessera's customers include the world's top semiconductor companies such as Intel, Samsung, Texas Instruments, Toshiba, Micron and Infineon. The company's stock is traded on the Nasdaq National Market under the symbol TSRA. Tessera is headquartered in San Jose, California. For information call 1.408.894.0700 or go to www.tessera.com

CONTACT:

Tessera
Julie Seymour, +1-408-383-360
jseymour@tessera.com