TSMC Press Release

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07/30/2018 - 00:34
Smart Tech, Smart Workforce, 60th IC Anniversary to Highlight SEMICON Taiwan
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SEMI
07/11/2018 - 13:00
Synopsys Users Group India Celebrates 19th Year with Record Gathering of the Semiconductor Design Community
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Synopsys
06/25/2018 - 03:21
Liberate AMS Mixed-Signal Characterization
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Cadence
06/25/2018 - 01:05
Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors
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Cadence
06/12/2018 - 00:36
Semiconductor Fab Equipment Record Spending Streak To Continue Through 2019
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SEMI
06/06/2018 - 06:54
TSMC Sets June 25 as Ex-Dividend Date
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TaiwanSemiconductor
05/23/2018 - 19:46
Vesper Raises $23M for Piezoelectric MEMS Mics
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SEMI
05/22/2018 - 08:49
MediaTek Unveils New Helio P22 Chipset to Power Mid-Range New Premium Smartphones
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MediaTek
05/01/2018 - 07:00
Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
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Cadence
05/01/2018 - 06:21
Cadence Supports New TSMC WoW Advanced Packaging Technology
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Cadence
04/30/2018 - 09:15
TSMC Certifies ANSYS Solutions for TSMCs Advanced 5NM Process
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Ansys
04/30/2018 - 08:07
Synopsys and TSMC Collaborate to Deliver DesignWare Foundation IP for Ultra-Low Power TSMC 22-nm Processes
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Synopsys
04/30/2018 - 07:20
TSMC Certifies Synopsys Design Platform for High-performance 7-nm FinFET Plus Technology
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Synopsys
04/30/2018 - 07:18
ANSYS Expands Its Solutions for TSMC Advanced Package Technology to Meet Growing Performance, Reliability and Power Demands
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Ansys
03/27/2018 - 05:01
Renesas Electronics Unveils Worlds First On-Chip Flash Memory Microcontroller Featuring Advanced 28nm Embedded Flash Technology
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Renesas Technology
03/20/2018 - 09:46
Automotive Chip Manufacturing in Japan Drives Innovation
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SEMI
03/12/2018 - 21:06
SEMI FabView: Fab Investment Multi-Year Growth Spree Expected to Continue in 2019
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SEMI
03/12/2018 - 08:24
Luxtera Demonstrates Silicon Photonics Innovations at OFC 2018
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Luxtera
02/25/2018 - 22:51
MediaTek Powers the Future of Mobile with New Helio P60 Chipset, Bringing Big Core Power & AI Experiences to Consumers
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MediaTek
02/13/2018 - 04:41
TSMC Board of Directors Proposes NT$8 Cash Dividend per Share
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TaiwanSemiconductor
01/29/2018 - 07:03
Synopsys' New ARC HS Development Kit Accelerates Software Development for ARC-based Systems
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Synopsys
01/26/2018 - 08:54
TSMC Breaks Ground on Fab 18 in Southern Taiwan Science Park
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TaiwanSemiconductor
01/24/2018 - 14:52
Digital Disruption and Industry Opportunity
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SEMI
01/17/2018 - 01:17
U.S. Electronics Innovation Leaps Forward Via Joint University Microelectronics Program
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DARPA
12/12/2017 - 15:25
Three innovators elected to National Academy of Inventors
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University of B...
12/07/2017 - 01:21
NVIDIA today introduced
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NVIDIA
12/05/2017 - 16:46
2017 A Record Year for the Industry
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SEMI
11/05/2017 - 12:25
ANSYS Wins Three TSMC Partner of the Year Awards
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Ansys
10/16/2017 - 18:03
Huawei Unveils the HUAWEI Mate 10 and HUAWEI Mate 10 Pro
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Huawei
10/16/2017 - 00:15
TSMC Senior Vice President Dr. Stephen Tso to Retire
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TaiwanSemiconductor
10/02/2017 - 16:34
An Inside Look at the October 2017 SEMI FabView
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SEMI
09/21/2017 - 04:12
TSMC Chairman Dr. Morris Chang Honored by Forbes Magazine as One of the Worlds 100 Greatest Living Business Minds
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TaiwanSemiconductor
09/18/2017 - 12:01
Cadence Recognized with Three TSMC Partner of the Year Awards
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Cadence
09/18/2017 - 08:40
TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event
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Synopsys
09/14/2017 - 10:11
TSMC and ANSYS Enable Automotive Reliability Solutions
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Ansys
09/13/2017 - 11:10
Cadence Delivers Design and Analysis Flow Enhancements for TSMC InFO and CoWoS 3D Packaging Technologies
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Cadence
09/13/2017 - 04:58
Mentor extends solutions for TSMC InFO and CoWoS design flows to help customers continue IC innovations
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Mentor Graphics
09/12/2017 - 09:46
ANSYS Achieves TSMC 12NM Certification to Enable Next-Generation Electronics
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Ansys
09/12/2017 - 07:44
Synopsys and TSMC Collaborate to Develop DesignWare Foundation IP for Low-Power TSMC 40-nm eFlash Processes
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Synopsys
09/12/2017 - 02:08
New Records in Fab Equipment Spending
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SEMI
09/11/2017 - 08:18
Synopsys IC Compiler II Certified for TSMC's Advanced 7-nm FinFET Plus Node
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Synopsys
09/11/2017 - 08:08
Synopsys Successfully Tapes Out Broad IP Portfolio for TSMC 7-nm FinFET Process
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Synopsys
09/11/2017 - 07:17
Synopsys' IC Compiler II Completes Certification for TSMC's 12-nm Process Technology
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Synopsys
09/11/2017 - 04:45
Cadence Tools and Flows Achieve Production-Ready Certification for TSMCs 12FFC Process
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Cadence
09/11/2017 - 01:44
Xilinx, Arm, Cadence, and TSMC Announce Worlds First CCIX Silicon Demonstration Vehicle in 7nm Process Technology
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Cadence
09/07/2017 - 19:48
Ambiq Micro and TSMC Deliver Worlds Lowest Energy Consumption for Huaweis Fitness Wearables
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TaiwanSemiconductor
09/07/2017 - 10:02
Cadence Delivers Comprehensive IP Portfolio for TSMC 16FFC Automotive Design Enablement Platform
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Cadence
08/24/2017 - 12:00
Students Complete 'Arguably Most Complex Chip Ever Created in Academia'
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Calit2
08/08/2017 - 10:15
Challenges and Opportunities in the OSAT Market
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SEMI
07/18/2017 - 16:47
Taiwan is Largest Semiconductor Materials Market as SEMICON Taiwan Approaches
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SEMI
06/19/2017 - 13:52
ANSYS and Synopsys to Partner in Accelerating Robust Design Optimization for Next Generation High-Performance Computing, Mobile and Automotive Products
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Ansys
06/05/2017 - 18:33
Historic Highs in Fab Spending for 2017 and 2018
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SEMI
05/24/2017 - 20:52
Brewer Science Showcases Enabling Sensor Technology for Smart Cities at COMPUTEX TAIPEI 2017
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SEMI
05/16/2017 - 17:22
Silicon Reclaim Wafer Market Forecast: $454 million by 2018
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SEMI
04/18/2017 - 13:27
Equipment and Materials 2017 Forecast
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SEMI
03/15/2017 - 12:50
Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology
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Cadence
03/15/2017 - 12:04
Mentor Graphics Announces Further Certification of Mentor Software for TSMC 12FFC and 7 nm Processes
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MENTOR
03/14/2017 - 12:06
ANSYS Completes TSMC 7nm Certification and Expands its Capabilities for InFO Packaging Technology, Enabling Reliable Electronic Products with Smaller and Thinner Footprints
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Ansys
03/14/2017 - 08:04
Cadence Achieves Certification for TSMCs 7nm Process Technology
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Cadence
03/13/2017 - 07:02
Cadence Expands Capabilities of Integrated Design and Analysis Flow for TSMC InFO Packaging Technology
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Cadence